Fan-out sensor package
US10467450B2 · kind B2 · utility
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1References
22Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 30, 2018 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/24195
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.