Electronic component and method for producing an electronic component

US10468317B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Thomas Schwarz · Rhede, DE
• Stefan Groetsch · Bad Abbach, DE
• Joerg Sorg · Regensburg, DE
• Christoph Koller · Nittendorf, DE

Key dates

• Filing date: Jul 27, 2018
• Grant date: Nov 5, 2019
• Expiry date: Jul 27, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0365
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.