Semiconductor chip and electronic system including the same
US10468330B2 · kind B2 · utility
1Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2014 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.