Patent · US Active

Heat management system

US10468331B2 · kind B2 · utility

2Cited by

1References

25Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Je-Young Chang · San Jose, US
Jae Whan Kim · Seoul, KR
Ravindranath V. Mahajan · Chandler, US
Blake Rogers · Mesa, US
Devdatta P. Kulkarni · Austin, US

Key dates

Filing date	Jan 12, 2018
Grant date	Nov 5, 2019
Priority date	—
Expiry date	Jan 12, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface.The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.