Method of manufacturing light emitting diodes having a supporting layer attached to temporary adhesive
US10468361B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 27, 2015 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Aug 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing at least one light emitting diode (LED) includes epitaxying at least one light emitting diode (LED) structure on a growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, in which the supporting layer has a Young's modulus greater than that of the adhesive layer; and removing the growth substrate from the LED structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.