Semiconductor device and semiconductor package including the same
US10468415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Dec 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
Abstract
The invention provides a semiconductor device including a capacitor capable of securing capacity and exhibiting improved reliability and a semiconductor package comprising the same. The semiconductor device includes: a substrate having a cell block; a plurality of capacitors, which are in the cell block of the substrate and have first electrodes; and a support pattern, which contacts sidewalls of the first electrodes of the plurality of capacitors and supports the plurality of capacitors, wherein the support pattern includes an upper support pattern including: a first upper pattern having a plate-like structure connected as a whole in the cell block; and a second upper pattern, which contacts a bottom surface of the first upper pattern and has a top surface having a smaller area than the bottom surface of the first upper pattern, the upper support pattern contacting sidewalls of upper ends of the first electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.