Patent · US Active

Integration of micro-devices into system substrate

US10468472B2 · kind B2 · utility

1Cited by
7References
24Claims
0Family size

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Key dates

Filing dateNov 22, 2017
Grant dateNov 5, 2019
Priority date—
Expiry dateNov 22, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10K77/111
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The micro-devices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.