Method of manufacturing a sealed thermoelectric module

US10468576B2 · kind B2 · utility

Assignee

• TEGMA AS · NO

Inventors

• Torleif A. Tollefsen · Kristiansand, NO
• Marianne Aanvik ENGVOLL · Kristiansand, NO

Key dates

• Filing date: Feb 10, 2016
• Grant date: Nov 5, 2019
• Expiry date: May 31, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N10/01

Abstract

A method for manufacturing a thermoelectric module utilizes solid-liquid interdiffusion bonding for both forming metallization, interconnection and bonding between thermoelectric elements and electric contacts and forming of a hermetic sealing of the thermoelectric module.