Elastic wave device and manufacturing method for the same
US10469053B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/021
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In an elastic wave device, a piezoelectric substrate is laminated on a support substrate including a recess. On one of a first principal surface and a second principal surface of the piezoelectric substrate, a functional electrode including an IDT electrode is provided. Passing-through sections are provided in the piezoelectric substrate and connected to a hollow section enclosed by the recess and the piezoelectric substrate. In a plan view of the piezoelectric substrate seen from the first principal surface, at least a portion of the passing-through sections is inside a minimum rectangular or substantially rectangular region encompassing an outer circumference of a region including the functional electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.