Piezoelectric module
US10469054B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Mar 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/175
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric module includes a piezoelectric thin film, a fixing layer, and a support substrate. The piezoelectric thin film is supported by the support substrate with the fixing layer in between. Functional conductors are provided on a surface of the piezoelectric thin film. A void is provided in the fixing layer to include a region overlapping with the functional conductors. A conductor pattern defining a circuit element is provided in a region of the void on a surface of the support substrate on the fixing layer side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.