Method and system for heat sinking of camera module
US10469715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2015 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P2700/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for heat sinking a camera module, which may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras, is described herein. Heating conductors and heat conductive pads may be arranged in a parallel orientation within the housing of the camera module to dissipate heat produced by the printed circuit boards (PCBs) and other components within. The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink, which may be a heat conducting material including but not limited to aluminum, aluminum alloys, or copper. The heating pads may also fill the air gaps within the housing of the camera module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.