Heat-pipe heat dissipation system and power device
US10470339B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Mar 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.