Hermetic feedthrough for an implantable medical device
US10471266B2 · kind B2 · utility
1Cited by
23References
20Claims
0Family size
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Key dates
| Filing date | Jul 12, 2016 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Sep 5, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.