Direct diode laser processing apparatus and sheet metal processing method using the same
US10471537B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A direct diode laser processing apparatus includes a laser oscillator that emits a multiple-wavelength laser beam, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece. According to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece, a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.