Heat de-bondable adhesive articles
US10471681B2 · kind B2 · utility
1Cited by
56References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2013 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Jul 3, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Heat de-bondable adhesive articles include a heat-shrinkable optical substrate with optically clear adhesive disposed on the two major surfaces of the heat-shrinkable substrate. Optical articles can be prepared by disposing the heat de-bondable adhesive articles between two optical substrates. Other optical articles can be prepared by disposing an optically clear adhesive layer and a heat-shrinkable optical substrate on an optical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.