Proximity sensor package having one or more grooves in a module cap
US10473764B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2017 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S17/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor package may include a source configured to emit a signal, a detector configured to receive a first reflection of the signal, and an isolator disposed between the source and the detector, where a surface of the isolator has one or more grooves configured to direct a second reflection of the signal away from the detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.