Patent · US Active

Method for processing a holding plate, in particular for a clamp for holding a wafer

US10475689B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

BERLINER GLAS KGAA HERBERT KUBATZ GMBH & CO. · DE

Inventors

Volker Schmidt · Lexington, US
Ralf Hammer · Freiberg, DE
Gregor Hasper · Berlin, DE
Mike Fischer · Berlin, DE

Key dates

Filing date	Jan 17, 2018
Grant date	Nov 12, 2019
Priority date	—
Expiry date	Jan 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6838
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for processing a holding plate (10) of a clamping device (in particular clamp wafer chuck) for holding a component, in particular a wafer, wherein the holding plate (10) has a SiC-based surface (12) on which at least one protruding, SiC-based surface element (13) is formed, includes the steps of locally limited heating of the holding plate (10) in a predetermined surface section and creating the surface element (13) at the predetermined surface section by chemical vapor deposition, in particular by means of laser CVD. Applications of the method exist in repairing a holding plate (10) of a clamping device or manufacturing a holding plate (10) of a clamping device. Furthermore, a holding plate of a clamping device for holding a component, in particular a wafer, is described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.