Fan-out semiconductor package
US10475751B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2018 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Aug 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.