Semiconductor device, solid-state imaging device and electronic apparatus
US10475845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2019 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.