Method for producing a plurality of components, and component

US10475955B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Sophia Huppmann · Geldersheim, DE
• Simeon Katz · Regensburg, DE
• Marcus Zenger · Abensberg, DE
• Dominik Scholz · Regensburg, DE

Key dates

• Filing date: Nov 30, 2016
• Grant date: Nov 12, 2019
• Expiry date: Nov 30, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/036

Abstract

A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.