Light-emitting diode package and method of manufacturing the same
US10475972B2 · kind B2 · utility
0Cited by
41References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2018 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Nov 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8514
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.