Method for manufacturing OLED panel

US10476041B2 · kind B2 · utility

Assignees

• BOE Technology Group Co., Ltd. · CN
• Ordos Yuansheng Optoelectronics Co., Ltd. · CN

Inventors

• Tao Yang · Beijing, CN
• Wei Song · Beijing, CN
• Zenghong Li · Beijing, CN
• Peng Chen · Beijing, CN
• Lin Liu · Gainesville, US
• Yonghong Zhang · Beijing, CN
• Ling-Kang Tong · Fremont, US
• Yaorong Liu · Beijing, CN

Key dates

• Filing date: Jan 23, 2017
• Grant date: Nov 12, 2019
• Expiry date: Feb 14, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/851

Abstract

A method for manufacturing an OLED panel is provided by embodiments of the present disclosure, including following steps of: manufacturing an OLED motherboard which comprises a plurality of OLED panel areas spaced apart from one another, each comprising a display region and a frit package region which is located on a periphery of the display region and is to encapsulate the display region by a frit; and cutting the OLED motherboard along a cutting line to obtain separated OLED panels; and the cutting line is located within the frit package region and at a predetermined distance inwards from an edge of the periphery of the frit package region.