Method and apparatus for chip-on board flexible light emitting diode
US10476543B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Oct 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lighting device is disclosed having a plurality of LED chips mounted on a single planar flexible substrate, wherein the single planar flexible substrate is disposed in an arcuate orientation. A heat sink having an arcuate surface shaped to approximate the arcuate orientation of the flexible substrate is coupled to the flexible substrate between complementary arcuate surfaces. A luminescent coating is disposed about a top surface of the arcuate single planar flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.