Apparatus, system, and method for cooling devices containing multiple components
US10477728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.