Methods of manufacturing security structures for security documents
US10479129B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB42D25/373
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method of manufacturing a hybrid security structure for a security document, the method comprising the steps of: providing a document substrate; applying to the document substrate, by a first process, a first element comprising a first electrically conductive region of the hybrid security structure; applying to the document substrate, by a second process, a second element comprising a second electrically conductive region of the hybrid security structure, wherein the first process is different from the second process; and electrically coupling the first and second electrically conductive regions of the hybrid security structure for detection by a capacitance sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.