Process for separating package blister from cards for recycling
US10479580B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2019 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | May 31, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/362
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method for separating a package blister from the cards which retain it to promote recycling of the component parts of a package. A thermoformed thermoplastic blister has a product bubble which extends from a peripheral flange to extend through an opening in a front card. The front card is affixed to a back card so as not to adhere to the blister flange. The blister has a pull feature which is accessible for gripping by a user to engage and remove the blister from the front card and the back card. To separate the blister from the cards a user grips the pull feature and pulls the blister frontwardly, thereby distorting the blister and extracting the blister from the cards, to fully separate the blister from the front card and the back card, permitting the entire package to be recycled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.