Heat-transferring and electrically connecting device and electronic device
US10480833B2 · kind B2 · utility
0Cited by
6References
25Claims
0Family size
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Key dates
| Filing date | Nov 2, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.