Through-board optical assembly

US10481350B1 · kind B1 · utility

Assignee

• SICOYA GMBH · DE

Inventors

• Moritz Grehn · Berlin, DE
• Marco Vitali · Berlin, DE
• Sebastian Höll · Roth, DE
• Andreas Karl Fredrik Håkansson · Berlin, DE
• Chenhui Jiang · Qiaonanxiang, CN

Key dates

• Filing date: Dec 11, 2018
• Grant date: Nov 19, 2019
• Expiry date: Dec 11, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/428
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.