System, method, and computer readable medium for walking pads: fast power- supply pad-placement optimization
US10482210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2016 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Feb 15, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A virtual force controlled collapse chip connection (C4) pad placement optimization frame-work for 2D power delivery grids is proposed. The present optimization framework regards power pads as mobile “positive charged particles” and current resources as a “negative charged back-ground.” The virtual electrostatic force is calculated from voltage gradients. This optimization framework optimizes pad locations by moving pads according to the virtual forces exerted on them by other pads and current sources in the system. Within this framework, three algorithms are proposed to meet various requirements of optimization quality and speed. These algorithms minimize resistive voltage drop (IR drop), the maximum current density, and power distribution network metal power dissipation at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.