Apparatus for bonding semiconductor chip and method for bonding semiconductor chip
US10483228B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jun 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/9211
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.