Bonding method of fixing an object to a rough surface
US10483231B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | Sep 27, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Sep 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.