Array substrate and manufacturing method thereof and display device
US10483289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jan 18, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/36
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An array substrate includes a carrier plate, a first heat dissipation layer, and a function layer sequentially stacked on each other. The function layer is arranged on one side facing a user. The function layer includes a plurality of drive devices, metal wires and connection sections arranged between the plurality of drive devices. The plurality of drive devices are formed with openings. The connection sections each have an end extending through the openings to connect with one of the drive devices and an opposite end extending across the metal wires to connect with an adjacent one of the drive devices. The first heat dissipation layer conducts heat from the metal wires, the plurality of drive devices, and the connection sections through the carrier plate for dissipation. A method for manufacturing the array substrate and a display device are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.