Optoelectronic device with silicon slice cover arranged downstream of a conversion element

US10483439B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Hubert Halbritter · Dietfurt, DE
• Britta Göötz · Regensburg, DE

Key dates

• Filing date: Jun 2, 2015
• Grant date: Nov 19, 2019
• Expiry date: Jun 2, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8515

Abstract

The invention relates to an optoelectronic component (10) comprising —a radiation-emitting semiconductor chip (2), —a conversion element (8) which is suitable for converting at least one part of the radiation (12) emitted by the semiconductor chip (2) into a converted radiation (13), said converted radiation (13) having a longer wavelength than the emitted radiation (12), and —a cover (9) which is permeable at least to the converted radiation (13) and which follows the conversion element (8) in a main emission direction, wherein —the conversion element (8) comprises a quantum dot converter material (7), —the conversion element (8) is arranged on a cover (9) inner face (15) facing the semiconductor chip, and —the cover has silicon (9) or consists of silicon.