Device for encapsulating a sensitive device and process for producing said device
US10483485B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Nov 16, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An encapsulation device comprises at least one assembly containing particles comprising at least a first material. The assembly has an open porosity. The particles: are distributed over a geometric structure that has a degree of compactness of said particles of greater than around 50% and preferably of greater than 60%, and are covered conformally by at least one layer referred to as an infiltration layer; the thickness of at least the infiltration layer closing off the porosity of the assembly comprising the particles covered by at least the layer, in the form of pores that are not connected to one another. A process for producing the encapsulation device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.