Electronic device having display with thin-film encapsulation
US10483493B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jan 8, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.