Patent · US Active

Grounding clip for bonded vanes

US10483659B1 · kind B1 · utility

1Cited by
24References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 19, 2018
Grant dateNov 19, 2019
Priority date
Expiry dateNov 19, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R2201/26
  • WIPO fieldEngines, pumps, turbines
  • WIPO sectorMechanical engineering

Abstract

A grounding clip for an organic matrix composite guide vane with a metallic sheath comprises the organic matrix composite guide vane includes a body having a leading edge and a trailing edge opposite the leading edge and a root end extending between the leading end edge and the trailing edge. The metallic sheath is attached proximate the leading edge and extends to the root end. A metallic attachment fitting has a receiver configured to receive the root end of the organic matrix composite guide vane for coupling the organic matrix composite guide vane to the metallic attachment fitting. The grounding clip is coupled to the sheath proximate the root end; wherein the grounding clip is electrically connected to the metallic attachment fitting and the metallic sheath.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.