Multilayer electrode assembly
US10483710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jul 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/2232
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Systems and techniques for multilayer electrode assemblies are generally described. In some examples, a multilayer electrode assembly may comprise a first dielectric material. In some examples, the first dielectric material may be shaped so as to form a channel defined by an interior surface. In various examples the multilayer electrode assemblies may comprise a first metal layer disposed adjacent to a first portion of the exterior surface of the first dielectric material. In various further examples, the multilayer electrode assemblies may comprise a second metal layer disposed adjacent to a second portion of the exterior surface of the first dielectric material. In some examples, the first metal layer may be disposed in a first spaced relationship with the second metal layer. In various examples, a substantially uniform electric field may be generated in the channel of the first dielectric material when a voltage is applied to the multilayer electrode assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.