Cooling system for tanks
US10483727B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 1, 2017 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Sep 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02B13/045
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat management system includes a tank and a thermal siphon attached to the tank. The thermal siphon contains a liquid that absorbs heat via thermal conduction from the tank. The liquid is heated to a vaporization point, and the heat from the vaporized liquid is transferred to cooling fins extending from the thermal siphon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.