Temperature instability-aware circuit
US10483973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Oct 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K3/356113
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A circuit includes: a first type of swing reduction circuit coupled between an input/output pad and a buffer circuit; and a second type of swing reduction circuit coupled between the input/output pad and the buffer circuit, wherein the first type of swing reduction circuit is configured to increase a voltage received by respective gates of a first subset of transistors of the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage, and the second type of swing reduction circuit is configured to reduce a voltage received by respective gates of a second subset of transistors of the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.