Substrate for high-frequency printed wiring board
US10485102B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1194
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.