Laser ablation method with patch optimization
US10486267B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2016 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jan 14, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser ablation method is provided for the engraving of a surface (7) of a two or three dimensional workpiece with a texture (16) by the laser beam (2) of a laser machining head (1). The surface engraving is conducted in one or more layers (17.1, 17.2), which are machined consecutively, wherein each defined layer (17.1, 17.2) to be machined is subdivided into one or more patches (11) intended be machined one after another with the laser beam (2). The borderline (18) of at least one patch (19) is determined in such a manner to follow along a path on the layer (17.1, 17.2, 17.x) which will not be affected by the laser beam (2) engraving of the laser machining head (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.