Epoxy core with expandable microspheres
US10486374B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Nov 9, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a formed structure with expandable polymeric shell microspheres. A first plurality of polymeric shell microspheres are heated from an unexpanded state to an expanded state to form a plurality of expanded microspheres. The plurality of expanded microspheres are mixed with an epoxy resin and a second plurality of unexpanded polymeric shell microspheres. The mixture is formed in a shape to create a preform. The preform is wrapped with fiber tape to create a wrapped preform. The wrapped preform is placed in a mold. The mold is heated and the second plurality of unexpanded microspheres expand from an unexpanded state to an expanded state. The mold is cooled and the formed structure is removed from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.