Devices including metal laminate with metallurgical bonds and reduced-density metal core layer
US10486393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Feb 25, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/722
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stiff, lightweight metal laminate includes a first continuous metal layer, a second continuous metal layer, and a reduced density metal core layer disposed between the first and second continuous metal layers. The reduced density metal core layer comprises a core metal and has an average density that is less than the density of the core metal. Planar metallurgical bonds secure the first and second continuous metal layers to the reduced density metal core layer. The metal laminate may be manufactured by press rolling the reduced density metal core layer sandwiched between the two continuous metal layers, after removing or overcoating the native oxide layer on each layer surface that contacts another layer in the metal laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.