Recyclable copper clad laminates containing fiber composition
US10486394B2 · kind B2 · utility
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1References
1Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 16, 2015 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Dec 16, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides recyclable copper clad laminates (CCLs) each including copper foil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.