Lamination device and lamination method
US10486404B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Apr 21, 2016 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Apr 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination device and a lamination method for attaching a film layer onto a substrate are provided. The lamination device includes a platform configured to carry and deliver a substrate, a layer application member configured to apply the film layer onto a surface of the substrate, a first roller configured to roll on the substrate having the film layer to perform a smoothing and bubble-removing operation, a deformable layer arranged on the first roller and capable of being deformed to change a rolling dot pattern at an outer circumferential surface of the first roller, thereby to enable the rolling dot pattern to match the surface of the substrate, and an alignment mechanism configured to align the substrate with the first roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.