Methods of encapsulating electrical windings in an encapsulant composition
US10487241B2 · kind B2 · utility
0Cited by
7References
15Claims
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Key dates
| Filing date | Oct 13, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of encapsulating an electrical winding in an encapsulant composition. The method includes: (i) providing an electrically insulated wire; (ii) applying the encapsulation composition to the electrically insulated wire to encapsulate the wire; and (iii) winding a further layer of wire around the encapsulated wire. The electrical encapsulant composition includes a silica containing inorganic-organic nano-hybrid matrix, and particles of refractory ceramic suspended in the inorganic-organic nano-hybrid matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.