Method of bonding a laser activated remote phosphor assembly, method of manufacture and a laser activated remote phosphor assembly
US10487390B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Mar 10, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Feb 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8515
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing a laser activated remote phosphor (LARP) sub-assembly, which may comprise: preparing a target composed of a material; activating the target such that the material is released from the target; directing the material released from the target in the direction of a wavelength converter and depositing the material released from the target onto a major surface of the wavelength converter creating a bonding film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.