LED heat pipe assembly
US10488029B2 · kind B2 · utility
0Cited by
0References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Mar 4, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lighting device that includes a heat sink coupled to a heat dissipation structure. The heat dissipation structure can include heat conduits operatively coupled to a light emitting device to receive and emit heat from the light emitting device. The heat conduits conduct heat from the light emitting device to the heat sink that is disposed above the light emitting device to protect the internal components of the lighting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.