Ultrasound probe with thin film flex circuit and methods of providing same
US10488502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/0629
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasound probe and method of forming an ultrasound probe are provided. The ultrasound probe comprises a two-dimensional (2D) transducer assembly having transducer elements arranged in rows and columns. The transducer elements have front and rear surfaces. The front surface is configured to transmit and receive ultrasound signals to and from an object of interest. A thin film flex circuit extends along the rear surface of the transducer assembly. The flex circuit has conductive traces arranged in layers and enclosed within a common dielectric layer. The dielectric layer has a homogeneous composition surrounding the layers of the conductive traces. The conductive traces are electrically interconnected to the corresponding transducer elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.