Photonic component and method for producing same

US10488595B2 · kind B2 · utility

Assignee

• SICOYA GMBH · DE

Inventors

• Moritz Grehn · Berlin, DE
• Sven Otte · Hohen Neuendorf, DE
• Christoph THEISS · Berlin, DE
• Stefan Meister · Berlin, DE
• David SELICKE · Berlin, DE
• Hanjo Rhee · Berlin, DE

Key dates

• Filing date: Jul 28, 2017
• Grant date: Nov 26, 2019
• Expiry date: Jul 28, 2037

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12107
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.